Confocal Sputtering Systems
The V6000 range of confocal sputtering system is designed for research and small volume production. The V6000 coaters are ideal for single wafer processing for universities and research laboratories.
Available with several options including RF & DC sequential or co-sputtering facility, heating, RF etch & biasing for wafer sizes up to 6-inch.
Many options are available for the V6000 confocal sputter systems, including:
About our V6000 Confocal Sputter System
Substrate heating to 800°C or Substrate cooling below 50°C during the most aggressive deposition processes
RF etch and biasing facility of substrate up to 600W including rotation, heating or cooling.
Baratron transducer pressure measurement of the process gas.
Multiple process gases for reactive deposition using positive shut-off mass flow controllers.
Up or downstream pressure control. Full system automation with colour touch screen pc and PLC control.
Datalogging of all major process parameters
Load lock entry system for single or multiple wafer processing.
Wet/dry roughing pump options from 20 m3.hr-1 to 110 m3.hr-1.
Turbo / Cryo high vacuum pumping options from 400 ltrs.sec-1 to 2,200 ltrs.sec-1.
Substrate rotation up to 50rpm.
Glovebox connection options.
Fully CE / UKCA marked.